LiveZilla Live Chat Software
Warning STRICT ERROR REPORTING IS ON
Efficient 3-D Bus Architectures for Inductive-Coupling ThruChip Interfaces

Efficient 3-D Bus Architectures for Inductive-Coupling ThruChip Interfaces

Starting at: Rs.5,500.00

5500 reward points

 Efficient 3-D Bus Architectures for Inductive-Coupling ThruChip Interfaces

 Wireless 3-D network-on-chips (NoCs) with inductive-coupling ThruChip interfaces provide a large degree of flexibility for customizing the number of arbitrary chips in a package after chips have been fabricated. To simplify the vertical communication interfaces, static time division multiple access (TDMA) is used for the vertical broadcast buses, while arbitrary or customized topologies can be used for the intrachip network. This paper proposes two techniques to break through the simple static TDMA-based vertical buses while maintaining a simple communication interface.


 


ClickMyProject Specifications
 
 
Including Packages
 
Specialization
 
  * Supporting Softwares   * 24/7 Support
  * Complete Source Code   * Ticketing System
  * Complete Documentation   * Voice Conference
  * Complete Presentation Slides   * Video On Demand *
  * Flow Diagram   * Remote Connectivity *
  * Database File   * Code Customization **
  * Screenshots   * Document Customization **
  * Execution Procedure   * Live Chat Support
  * Readme File   * Toll Free Support *
  * Addons    
  * Video Tutorials    
       
 

*- PremiumSupport Service (Based on Service Hours) ** - Premium Development Service (Based on Requirements)


Add to Cart:

  • Model: PROJ7385
  • 999 Units in Stock
  • Manufactured by: ClickMyProjects

Please Choose:

Downloadable







This product was added to our catalog on Saturday 24 June, 2017.

  0