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Design of a CMOS System-on-Chip for Passive, Near-Field Ultrasonic Energy Harvesting and Back-Telemetry

Design of a CMOS System-on-Chip for Passive, Near-Field Ultrasonic Energy Harvesting and Back-Telemetry

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 Design of a CMOS System-on-Chip for Passive, Near-Field Ultrasonic Energy Harvesting and Back-Telemetry

 Many packaging and structural materials are made of conductive materials such as metal or carbon-fiber composites, which limits the use of embedded radio frequency-based telemetry systems for sensing. In this paper, we present the design of a complete passive ultrasonic energy harvesting and back-telemetry system that exploits near-field acoustic coupling to wirelessly transfer energy and data across conductive barriers. The use of near-field operation makes the telemetry robust to multipath reflections that occur at barrier discontinuities and robust to crosstalk when multiple sensors are simultaneously interrogated.


 


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  • Model: PROJ7369
  • 999 Units in Stock
  • Manufactured by: ClickMyProjects

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This product was added to our catalog on Saturday 24 June, 2017.

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